Bryan J. LempiaPatent Attorney - Partner
direct: 312.854.8360 main: 312.291.0860 fax: 312.291.0864
email: blempia@lsk-iplaw.com
Professional ExperienceBryan Lempia brings a diverse professional background to Lempia Summerfield Katz LLC. He has extensive experience in U.S. and foreign intellectual property matters and has obtained design and utility patent protection for clients involved in a vast array of technologies in various industries. Bryan has written and prosecuted countless U.S. origin design and utility patent applications. He has also handled U.S. filing and prosecution for foreign originated cases from non-U.S. clients and associates. Legal ExperiencePrior to forming Lempia Summerfield Katz LLC, Bryan was a partner in a large, well respected IP firm in Chicago and brings invaluable experience from firms big and small. He has worked in Chicago, Minneapolis, Milwaukee, and Detroit at IP firms as diverse as these metropolitan areas. Non-Legal ExperienceBryan’s career began as a mechanical engineer with the Chrysler Corporation. As an engineer, he gained business insight and technical experience in product design, testing, development, manufacturing, and quality assurance.
Honors and Distinctions
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primary expertise areas Mechanical Electromechanical Industrial Design Automotive
state bar admissions Illinois Michigan Minnesota
Admissions U.S. Patent & Trademark Office
Education J.D., magna cum laude, University of Detroit School of Law, 1993
B.S., Mechanical Engineering, The Pennsylvania State University, 1985 |